《盖世汽车：2023中国车规级芯片产业白皮书（60页）.pdf》由会员分享，可在线阅读，更多相关《盖世汽车：2023中国车规级芯片产业白皮书（60页）.pdf（60页珍藏版）》请在本站上搜索。 1、2023Contents313.1 3.2 3.3 3.4 3.5 22.1 2.2 2.3 2.4 2.5 1.1 1.2 1.3 1.4 1.5 1.1 3-51.EDA2.IP1.2.3.4.5.6.7.8.9.10.11.12.13.14.15.16.17.18.19.20.1.2.3.4.5.6.7.8.910.1.2.3.4.5.6.7.8.9.10.1.2 9MCUDSPMPUCPUGPUNPUASICFPGASoCIGBTSiC/GaNMOSFETDRAMSRAMNOR FLASHNAND FLASHEEPROMLDODC/DCAC/DCPMICSBCCAN/CAN FDLIN2、ETHPHYWiFiNFCUWBT-BOXV2XeSIM/eSAM/LED/AILED1.3 40100300-8001.4:(/(/)403003,000605008,00010080014,000,26%,18%,14%,12%,9%,8%,6%,5%,1%,1%MCUCMOSe-flash65nm-28nm65nm50-100SOCCMOS16nm-7nm7nm5-101m60-90DC/DCBCD power0.13m-0.35m90-130BCD power0.13m50-70DDR3D NANDVLSI15-25nm20-30Flash3D NAND45-65nmMEMS0.1m-3、0.35m30-40CAN&LIN1m60-80CMOS28nm0.13m/28-55nmCMOS7nmIGBTSiC MOSFET0.18m20-40MOS-1,0001.4 SKSKARM2022,25%,20%,18%,15%,6%,16%IC1/21.5 IGBT202250025%2402022450203010%20%110202162021117740385202211NTT8Rapidus2027270020215K10SK1535102.9SK40%50%10%20%EDAEDAIP90%ARM92%ASML14nm90nmMCUSoCMCUSoC50%3nm/5nm14nm4、52%21%15%4%1.5 2023.032025302030702022.112021.112021.022020.11(20212035)2020.0725%2020.022018.072018-20201.5 发布地区发布时间政策名称重点内容北京2022.01北京经济技术开发区关于加快推进国际科技创新中心建设 打造高精尖产业主阵地的若干意见（简称“科创20条”）鼓励领军企业围绕车规级芯片、量子计算、细胞与基因治疗、元宇宙等前沿科技领域开展关键技术攻关，引导企业持续加大研发投入对承担“白菜心”工程的单位，给予研发投入最高50%的资金支持，支持金额最高为5,000万元天津2021.12天津5、市新一代信息技术产业发展“十四五”专项规划加快核心技术源头创新，聚焦高端芯片、关键器件、特色工艺、关键设备和原材料领域，推进国产CPU、射频芯片、通信芯片、汽车芯片、光通信芯片等一批核心技术突破，加快集成电路特色工艺研发和产业化，协同推进集成电路设备、核心零部件和硅片、第三代半导体等关键材料研发与产业化广东2022.06广州市智能网联与新能源汽车产业链高质量发展三年行动计划（2022-2024年）提升智能网联汽车关键核心零部件、核心技术供给水平，重点推动自主可控汽车芯片推广应用，形成较完备的汽车零部件产业供应体系，汽车零部件工业总产值达到1,800亿元江苏2022.01组织申报2022年度江苏6、省科技计划专项资金（重点研发计划产业前瞻与关键核心技术）项目聚焦第三代半导体、先进碳材料等重点优势领域，以及当前亟需攻关突破的工业软件、汽车芯片等关键实际问题，通过公开征集研发需求，组织专家凝练榜单，部署5项揭榜挂帅任务浙江2022.06关于省十三届人大六次会议嘉29号建议的答复A充分发挥我省在模拟芯片产业的优势，支持士兰微、斯达微等省内芯片龙头企业投资汽车芯片项目，指导省内已建、新建芯片生产线通过车规级验证，扩大车规级芯片生产能力，提高车规级芯片生产质量安徽2022.11贯彻落实实施方案落实高端通用基础零部件、重大装备配套专用基础零部件、汽车芯片等产品认证制度，提升认证一致性保障能力，促进基7、础零部件、元器件质量提升2022.07关于省政协十二届五次会议第0750号提案答复进一步组织关键核心技术攻关。全力支持长鑫、格易、全芯智造、杰发科技、聆思科技等开展存储芯片、EDA软件、汽车芯片、人工智能芯片攻关山东2022.03“十大创新”“十强产业”“十大扩需求”2022年行动计划补齐突破产业链薄弱环节，重点聚焦汽车芯片、液压件、机床功能部件、船用发动机等产业链关键环节开展协同创新、精准攻关，研制突破5种以上新技术和产品，推动产业基础高级化升级1.5 2022.0520222022.074541,000MCUMCU2021.082022.022021.0620212021.1133Cont8、ents313.1 3.2 3.3 3.4 3.5 22.1 2.2 2.3 2.4 2.5 1.1 1.2 1.3 1.4 1.5 2.1 预计2025年、2030年中国乘用车市场规模分别超过2,600万辆、3,000万辆20301,1003001,893 1,817 1,702 1,694 1,387 1,195 830 125 331 653 884 1,186 1,448 2,171 2020202120222023E2024E2025E2030E2,0182,1482,3552,5782,5733,0012,643118 142 167 180 290 456 504 559 7669、 1,150 2020202120222025E2030E300-5001,000L43,0002030450L3L4/L5630-1,0002025NEV54%1,4002030NEV72%2,10020255502.2 MCU232630333842466965768410010413720192020202120222023E2024E2025EMCU2020MCU6520251372021-202520.5%2022-2025MCU333842462021-2025CAGR11%MCU8MCU16MCU32MCUX-by-wire8MCU166%83217%77%MCUMCUMCUMC10、U30%70MCU300MCUMCU2.2 SOC56.788.1116.7141.6173.9203.955.4%32.5%21.3%22.8%17.2%0%10%20%30%40%50%60%0501001502002502020202120222023E2024E2025E400 735 973 1,209 1,435 1,646 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DRAM(DDRLPDDR)NAND(e.MMCUFS)L1/L22030L4L5L4/L5ADASGBTBL5L120DRAM8NAND125TBDRAMNAND&4-64GB64-512GBADAS/6-64GB8-32GB0.5-2GB4-32GB4-16GB64-256GB0.5-1GB8-512GB1-4GB8-512GB-14、151GB-1856GBGB/SL125-50GB/s8GB DRAM8GB NANDL225-50GB/sTypical100GB/sMax8GB DRAM8GB NANDL3200GB/sTypical100GB/SMin8GB DRAM25GB NANDL4300-600GB/s16GB DRAM256GB NANDL5300-600GB/s16GB DRAM256GB NANDADAS3446525970822020202120222023E2024E2025ECAGR=19.3%GBTBMordor Intelligence2.2 PMICBMSAC/DCDC/DCLDOICAFEB15、MSSOCSOH800VAFEBMSAFE4.57.210.213.216.320222023E2024E2025E2026EAFE/ADAS17.518.218.119.220.321.44%-0.55%6.08%5.73%5.42%-1%0%1%2%3%4%5%6%7%051015202520202021E2022E2023E2024E2025EMouser2.2 V2VV2XCANLINFlexRayMOSTFPD Link 10100L4/L580-1201-24-54G/5GOTA1TBOXV2X1T-BOXWIFIGNSSUWBNFCCAN/LINFlexRayMOSTPHYSwi16、tch40-50SerDesUSBADASIVI2.5G/5G/10GE/E10%50%20202030E19.4305581137202120222023E2024E2025ECAGR=63.1%2.2 OTAUSBWIFINFCOTAT-BOXV2XESAMUWBNFC2,126 2,771 3,613 4,710 6,140 8,004 20212022 2023E 2024E 2025E 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XavierTI81558156820A81558156820A8155820A-Mobileye EyeQ4Drive Orin-XOrin-X42、+TI TDA4TINXP8155TI8155TI01TINXPNXP8155Mobileye610J3TI TDA4TIJ3NXPNXPAC8025H3Mobileye-NXPNXPAC8025990A610TI2.4 4/5EDAMCU552.4 5/5Tier1Tier1Tier1MobileyeMobileyeTITIMobileyeTITIMobileyeTIMobileyeMobileyeTIACUTITITier1Tier1LGTITINXPNXPNXP2.5 1/2芯片设计晶圆制造封装测试EDASynopsysCadenceSiemens95%:MCULKAOntoArFiEU43、VPVD/CVD28nmALDEDA2.5 2/2ASIL B/C/DAEC-Q100 Grade2100TOPS1-100TOPS5%EDAIPASIL B/DAEC-Q100 Grade1/2/35%IPASIL B/DAEC-Q100 Grade0/190nmPMICAFEDC-DCBCDASIL B/DAEC-Q100 Grade0/1LEDASIL B/DAEC-Q100 Grade0/1/2/3SRAMDRAMNOR FLASH10%EEPROMNAND FLASHASIL B/DAEC-Q100 Grade0/1/24%ASIL BAEC-Q100 Grade 24G/5G3%C44、ANLINAEC-Q101AQG32490nm15%-20%ASIL BAEC-Q100 Grade1/25%5%15%Contents313.1 3.2 3.3 3.4 3.5 22.1 2.2 2.3 2.4 2.5 1.1 1.2 1.3 1.4 1.5 3.1 20212023IC40013SK2022IC568.0312.4%2022IC3005GARMIC-300IC3002022Q1()()()EDA50%2022529A0750EDA3.1 ICEDAIPEDAIP3.2 ICIC1354132050%5000CPU5,()30%,1000IP EDA,30%,500IC3.2 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